Advanced Micro Devices announced plans to invest more than US$10 billion in Taiwan’s AI supply chain ecosystem while expanding production of next-generation server processors using Taiwan Semiconductor Manufacturing Company’s advanced 2nm process technology.
The investment will strengthen partnerships with Taiwanese companies across chip packaging, substrates, and server manufacturing to support growing global demand for AI infrastructure. AMD said the initiative will help accelerate development of rack-scale AI systems and next-generation data center technologies.
A key focus is advanced packaging, including Elevated Fanout Bridge (EFB) technology. AMD is collaborating with ASE Technology Holding and Siliconware Precision Industries to enhance chip interconnect performance and energy efficiency, while working with Powertech Technology Inc. on scalable AI chip production technologies.
AMD also confirmed that production of its next-generation EPYC “Venice” server processor has been ramped up in Taiwan using TSMC’s 2nm technology, making it the first high-performance computing product in the industry to adopt the process. The company said the processors will support growing AI workloads and form part of its upcoming Helios AI infrastructure platform.
