A research team at Taiwan’s National Tsing Hua University has developed a
laser coating technology that simplifies chip manufacturing while reducing
energy consumption and emissions. Led by Professor Lee Ming-tsang, the
method enables the creation of one-step 3D-patterned coatings on curved
surfaces, thereby reducing production time, material costs, and carbon
footprint.
The technology, likened to one-step 3D printing, builds micron-scale metal
structures using a laser-based process. It evolved from Lee’s earlier work on
laser sintering in the U.S. and was developed with National Taiwan University
and National Applied Research Laboratories.
Potential applications include flexible electronics, transparent displays, and
wearable medical devices. While not yet suited for mass production, the
system has attracted interest from a local semiconductor firm and shows
promise for high-precision, customized manufacturing.
