Taiwan Semiconductor Manufacturing Company expects its 2-nanometer chip production capacity to grow at a compound annual rate of 70% from 2026 to 2028, reflecting rising demand for advanced semiconductor technologies.
Speaking at the company’s 2026 Technology Symposium in Silicon Valley, Senior Vice President Cliff Hou said five fabs—two in Hsinchu and three in Kaohsiung—will begin mass production of 2nm chips this year. He added that the first-year 2nm output is expected to be 45% higher than the initial production volume of 3nm chips in 2023.
TSMC also plans continued expansion of its 3nm process capacity, forecasting annual growth of about 25% between 2022 and 2027. Advanced packaging technologies are scaling rapidly as well, with CoWoS capacity expected to grow more than 80% annually and SoIC capacity over 90% per year.
Overseas expansion is also accelerating, with TSMC projecting major output increases at its fabs in Arizona and Kumamoto, Japan.
