TSMC announced that its 2-nanometer N2 chip is set for mass production in 2025, meeting performance and yield expectations.
The new technology will be 10-15% faster and more power-efficient than current N3E chips, with over 15% higher chip densities. Additionally, TSMC plans to introduce the advanced N2P process and A16 technology in late 2026, further boosting performance and power efficiency.
The company is also progressing on InFO wafer-level packaging for high-density interconnects, crucial for mobile and high-performance computing applications.
