Powertech Technology Inc. forecasts single-digit revenue growth this year, driven by strong demand for AI devices and data centers. CEO Boris Hsieh said the company is investing in advanced packaging technologies, including chip-on-wafer-on-substrate (CoWoS), aiming to offer complete solutions and capitalize on AI growth opportunities.
AI applications contributed 8% of revenue last quarter, up from 6% in Q2. High-bandwidth memory (HBM) expansion is expected to drive further orders from major memory chip makers, boosting momentum.
Despite a 16% revenue drop last year to NT$70.44 billion, revenue is projected to grow this year, excluding contributions from the Xian plant after its supply agreement with Micron ended in June. Q3 revenue fell 0.8% annually to NT$18.3 billion, with net profit up 8% to NT$2.15 billion.
Gross margin improved to 21.4%, and net profit for the first three quarters rose 27.5% annually to NT$6.57 billion, with earnings per share reaching NT$7.05.
